Home > 3D and 2D Mechanical Heatsink Design

3D and 2D Mechanical Design

Heatscape design and manufacturing teams utilize the latest in 3D CAD design tools such as Soldworks, ProE, and AutoCAD to accurately and realistically design thermal solutions, and to insure its fit and function within customer applications. Thermal designs can come directly from the customer (build to print) where Heatscape engineers can do a thorough and detailed DFM review (Design-For-Manufacturing) to make sure that thermal solutions are manufacturable and within appropriate tolerances.

Rendered CAD image

Real View 3D Rendered image of heatsink concept provides customer with clear image of how product will look in real life.

Board Level CAD

Heatsink concept utilizing heatpipes to move heat from the top side of the board to the bottom where more airflow is present.

Complete Networking Card

Complete A-Z thermal solution for main telecom card, pluggable optics modules, as well as duaghter card.

PCI Card

Low-profile high-performance PCI-E heatsink concept that utilizes the entire design envelope.

Wind Tunnel

Heatscape's mechanical design of in-house modular wind-tunnel.