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Split feature image showing an aluminum cold plate in a vacuum brazing furnace and in a CAB furnace

What Are the Differences Between Vacuum Brazing and CAB for Liquid Cold Plates?

Quick Answer Vacuum brazing and CAB (Controlled Atmosphere Brazing) are two thermal joining methods for aluminum liquid cold plates. Vacuum brazing uses a high-vacuum furnace with no flux, producing cleaner, higher-strength, leak-tight joints ideal for high-reliability applications. CAB uses nitrogen atmosphere with flux, offering lower cost and faster cycle times for standard, less demanding cold […]

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Cross-section of a heatsink and chip showing TIM pump-out, center voids, and edge squeeze-out

What Are the Root Causes of Thermal Interface Material (TIM) Pump-Out Effect?

Quick Answer TIM pump-out occurs when repeated thermal cycling causes thermal interface material to migrate out from between a component and heatsink, thinning the bond line and increasing thermal resistance. Root causes include mismatched coefficients of thermal expansion (CTE), low-viscosity TIM formulations, insufficient mechanical clamping, and excessive thermal cycling frequency or amplitude over the product’s […]

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Copper cold plate and aluminum radiator connected in a liquid cooling loop with corrosion forming near the metal transition

How to Prevent Galvanic Corrosion in Dual-Metal Liquid Cooling Loops

Quick Answer Galvanic corrosion in dual-metal liquid cooling loops is prevented by electrically isolating dissimilar metals, selecting metals close together on the galvanic series, using corrosion-inhibited coolant, and controlling coolant conductivity. Common prevention methods include dielectric fittings, sacrificial anodes, protective coatings, and proper coolant chemistry management to stop electrochemical reactions between copper, aluminum, and other […]

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Heat sink mounting pressure applied with spring-loaded screws over a processor and thermal interface material

How Much Mounting Pressure Does a Heat Sink Require?

Quick Answer A heat sink requires enough mounting pressure to compress the thermal interface material, remove air gaps, and maintain uniform contact without damaging the component or circuit board. There is no universal pressure value. The correct load depends on the component’s mechanical limit, contact area, TIM specifications, heat sink design, and mounting hardware. Mounting […]

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Multiple precision heat sink assemblies mounted on electronic circuit boards for thermal management.

Why Machined Heat Sinks Are Useful for Prototype and Low-Volume Electronics

Why is CNC machining the preferred manufacturing method for heat sinks during the prototyping and low-volume production phases of electronic development? CNC machined heat sinks are essential for these stages because they offer unmatched design flexibility and rapid turnaround without the high upfront costs of custom tooling. This allows engineers to validate thermal designs, iterate […]

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Small heat sink mounted on a circuit board for cooling high-density electronic components.

How Heat Pipe Heat Sinks Support High-Density Electronics

How do heat pipe heat sinks enable the cooling of high-density electronics where traditional solid-metal coolers fail? Heat pipe heat sinks support high-density electronics by using two-phase heat transfer to move thermal energy away from concentrated “hot spots” up to 100 times faster than solid copper. By integrating these pipes into custom assemblies, engineers can […]