Facebook Twitter Instagram Youtube
Contact Us

Active Cooled Fansinks 

  • Home
  • Active Cooled Fansinks 
Active cooled heatsink with integrated fan, copper heatpipe, and extended copper cold plate

Active Cooled Fansinks 

Our active heat sinks can be custom‑built according to your needs. As the functionality and computing power of graphics boards and GPUs continue to rise, thermal challenges increase significantly. Heatscape has designed, developed, and manufactured numerous graphics card thermal solutions for both 1‑slot and 2‑slot products using a variety of innovative methods. Independent floating core solutions are also available for use in dual GPU applications to alleviate tolerance issues associated with height variations between two chips.

These fansinks deliver superior cooling performance by combining precision‑engineered heat pipes with high‑efficiency fans, ensuring stable operation even under heavy computational loads. Their modular design allows for easy customization to meet specific airflow, noise, and space requirements—making them ideal for gaming systems, AI workstations, and industrial computing platforms.

 

Request a Free CAD Review

Fansink on Board

Vapor chamber integrated with fan shroud, for deployment on customer “DevKit”.

Fansink on Board

Heatpipe Assembly with Integrated Fan

Heatpipe assembly with integrated fan, moving heat from a high-powered strip of components to a remove radiator. Fansink assembly comes fully turn key with connectorized PWM fan and TIM pre-applied.

Heatpipe Assembly with Integrated Fan

Compact Active Cooling Assembly

Actively cooled thermal solution with two fans integrated into it. Part will come fully connectorized and turn-key, ready to install and work upon arrival.

Compact Active Cooling Assembly

Dual Active Cooling Module Designs

Two actively cooled thermal solutions spliced together into one connector.

Dual Active Cooling Module Designs

Vapor Chamber Heatsink

Vapor chamber heatsink integrated with a fan and shroud, to create fully turn-key and stand alone thermal solution.

Vapor Chamber Heatsink

Custom Active Cooled Fansink Assembly

Active cooled fansink assembly which combined heatpipe, remote radiator, and fan to create a fully turn-key stand-alone solution.

Custom Active Cooled Fansink Assembly

Dual-fan Active Fansink with Vapor Chamber Base

Dual-fan active fansink with vapor chamber base. A large TIM pad is used to bond the fansink to the surface, and insure proper thermal contact.

Dual-fan Active Fansink with Vapor Chamber Base

Embedded Heatpipe Fansink

Embedded heatpipe fansink for stand-alone cooling of a high-powered chip.

Embedded Heatpipe Fansink

Extruded Aluminum Heatsink with Fan Shroud

Combination of aluminum extrusion heatsink and sheet metal shroud with fan integrated. Forms the top of a system to seamlessly integrate the thermal solution into the overall chassis.

Extruded Aluminum Heatsink with Fan Shroud

Low-Profile Active Fansink Assembly

Active cooled fansink assembly with precision fabricated grooves milled into the base. The grooves will mate with the “negative” of the same pattern on the heat source to create a thermal conduction path.

Low-Profile Active Fansink Assembly

Compact Active Cooled Fansink

Actively cooled fansink, which integrated high-performance vapor chamber with a custom-made sheet metal shroud, with fan. Serves as a stand-alone solution that can be used in PCIe form factor.

Compact Active Cooled Fansink

500W+ Active Cooled Fansink

500W+ active cooled fansink, with vapor chamber bottom and c-shaped heatpipes moving heat to the fin tops. Serves as a stand-alone solution for benchtop testing of high-powered a/I chips.

500W+ Active Cooled Fansink
Fansink on Board Fansink on Board
Heatpipe Assembly with Integrated Fan Heatpipe Assembly with Integrated Fan
Compact Active Cooling Assembly Compact Active Cooling Assembly
Dual Active Cooling Module Designs Dual Active Cooling Module Designs
Vapor Chamber Heatsink Vapor Chamber Heatsink
Custom Active Cooled Fansink Assembly Custom Active Cooled Fansink Assembly
Dual-fan Active Fansink with Vapor Chamber Base Dual-fan Active Fansink with Vapor Chamber Base
Embedded Heatpipe Fansink Embedded Heatpipe Fansink
Extruded Aluminum Heatsink with Fan Shroud Extruded Aluminum Heatsink with Fan Shroud
Low-Profile Active Fansink Assembly Low-Profile Active Fansink Assembly
Compact Active Cooled Fansink Compact Active Cooled Fansink
500W+ Active Cooled Fansink 500W+ Active Cooled Fansink

Frequently Asked Questions

What is an active cooled fansink?

An active cooled fansink is a heatsink with an integrated fan that actively forces air through the fins to remove heat. This design significantly improves cooling performance compared to passive heatsinks. It is commonly used in high-power electronic systems where efficient heat dissipation is critical for maintaining stable operation and preventing thermal throttling.

When should I use an active cooled fansink instead of passive cooling?

You should use an active cooled fansink when heat loads exceed what passive cooling can handle or when airflow is limited. It is ideal for high-performance components such as CPUs, GPUs, and AI processors. Active cooling ensures consistent temperature control and helps prevent overheating in demanding environments.

What makes active cooled fansinks effective for high-power electronics?

Active cooled fansinks are effective because the integrated fan directs airflow precisely over heat-generating components. This increases heat dissipation efficiency and reduces thermal buildup. By improving airflow and heat transfer, these systems help maintain stable performance even under continuous or heavy workloads.

Can active cooled fansinks be customized for specific systems?

Yes, active cooled fansinks can be fully customized with various fan sizes, airflow designs, shrouds, heatpipes, or vapor chamber integrations. These configurations are tailored to meet specific thermal and mechanical requirements. Custom solutions ensure optimal cooling performance and seamless integration into complex system architectures.

Are active cooled fansinks suitable for compact or PCIe form factor designs?

Yes, active cooled fansinks are well-suited for compact systems and PCIe form factor applications. They are designed to deliver strong cooling performance within tight spaces and restricted airflow environments. Their modular and integrated design makes them easy to install in dense electronic systems.

What components are typically included in a fansink assembly?

A fansink assembly typically includes a heatsink base, fin structure, and an integrated fan. It may also incorporate heatpipes, vapor chambers, connectors, and thermal interface materials. These components work together to maximize heat transfer and ensure efficient, reliable cooling in various applications.

Can active cooled fansinks handle very high heat loads like 500W+ systems?

Yes, advanced active cooled fansinks can handle very high heat loads, including systems exceeding 500 watts. They often combine forced airflow with heatpipes or vapor chambers to enhance thermal performance. These solutions are widely used in high-performance computing, AI hardware, and other demanding applications.

What is a heatsink calculator?

A heatsink calculator helps estimate thermal performance by analyzing heat dissipation, airflow, and material properties to determine optimal cooling solutions.

READ MORE