As power density continues to rise in servers, AI hardware, high-performance CPUs, DIMM modules, optics, and industrial electronics, air cooling is not always enough to maintain stable operating temperatures. Cold plates and liquid-cooled assemblies transfer heat directly from high-power components into a controlled liquid flow path, providing more efficient cooling for compact and thermally demanding systems.
Heatscape designs custom cold plates and liquid-cooled assemblies using aluminum, copper, brazed, bonded, welded, micro-skived, and manifold-based configurations. These solutions can be engineered for high heat loads, low temperature rise, balanced coolant flow, and system-level integration, including tubing, fittings, manifolds, and sealed assemblies.