Today’s high-performance ASICs, GPUs, HBM modules, and line card components often have different heights, power loads, and thermal contact requirements within the same compact system. Floating Core Assemblies help solve these challenges by using independently compliant contact points that maintain consistent pressure across uneven component surfaces. These designs can integrate vapor chambers, heatpipes, zipper fins, and spring-loaded structures to improve heat spreading, reduce thermal gaps, and support reliable cooling for multiple chips at once. Heatscape’s engineering team can support these designs with custom mechanical design and DFM, finite element analysis, and CFD thermal analysis for complex PCB layouts, high-density electronics, networking hardware, and advanced computing applications.