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Vapor Chamber Heatsinks

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Copper vapor chamber base with tall fin heatsink for high-power cooling.

Vapor Chamber Heatsinks

Today’s CPUs, GPUs, and high performance ASICs are continually increasing their capacity, speed, and power, while being placed into smaller, and more compact form factors, leading to increased power density. This leads to greater challenges from a thermal management perspective. Vapor Chamber Heatsinks, which work based on heatpipe principles, offer improved spreading efficiency, higher thermal conductivity, and reduced weight for these applications. Heatscape’s engineering team can deliver custom vapor chamber heatsink solutions in custom sizes and shapes, including single and multi-stepped vapor chamber bases.

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3D VC

Vapor chamber has been integrated with vertical pipes (known as 3D VC) to create one large fluid loop for maximum efficiency in moving heat upwards in tall applications.

3D VC

3D VC-2

Vapor chamber has been integrated with vertical pipes (known as 3D VC) to create one large fluid loop, and then bent over to create 2U solution for limited height applications.

3D VC-2

3D VC-3

Vapor chamber has been integrated with vertical pipes (known as 3D VC) to create one large cube for cooling of very high-powered chips.

3D VC-3

Board VC

High performance low profile vapor chamber heatsink for cooling of main chip and surrounding components.

Board VC

Copper VC Base with Tall-Fins

Vapor chamber base, left unplated to show the original copper color. Exposed copper is treated with anti-oxidation coating to preserve appearance without blackening.

Copper VC Base with Tall-Fins

Thin VC with Customized Clearances and Geometry

Thin vapor chamber with customized clearances and geometry for cooling of high-powered package in low-height application.

Thin VC with Customized Clearances and Geometry

A High-performance T-shaped VC

A high-performance T-shaped vapor chamber heatsink assembly designed for dense power electronics, combining a copper vapor chamber base with zipper fin structures for efficient heat spreading and airflow optimization.

A High-performance T-shaped VC

Compact Vapor Chamber Heatsink

Compact vapor chamber heatsink combined with C-shaped heatpipes to move heat from the chip to the upper regions of the zipper fins.

Compact Vapor Chamber Heatsink

Large Footprint Vapor Chamber Heatsink

Large footprint vapor chamber heatsink featuring a low-profile form factor, ideal for networking and telecom systems requiring high performance within tight mechanical envelopes.

Large Footprint Vapor Chamber Heatsink

Custom Vapor Chamber Heatsink

Custom vapor chamber heatsink assembly developed for demanding electronic applications with high-powered ASICs and limited height.

Custom Vapor Chamber Heatsink

High Performance VC Designed for ASICs

High performance vapor chamber designed for ASICs with high-heat-density zones.

High Performance VC Designed for ASICs

High Performance VC Designed for ASICs

High performance vapor chamber designed for ASICs with high-heat-density zones, along with complex geometry to maximize heat transfer in the lateral direction.

High Performance VC Designed for ASICs

High Performance Vapor Chamber

High performance vapor chamber designed for ASICs with high-heat-density zones, maximizing heat transfer in the lateral direction.

High Performance Vapor Chamber

VC with Etched Bottom Mating Surface

High performance vapor chamber with etched bottom mating surface to improve mating between ASIC and heatsink.

VC with Etched Bottom Mating Surface

Low-profile VC with Curved Feature

Low-profile vapor chamber with curved feature implemented into the base and fins, to allow for clearance of tall components placed adjacent to the main chip.

Low-profile VC with Curved Feature

Vapor Chamber Heatsink with “Deep Draw” Emboss Technique

Vapor chamber heatsink with “deep draw” emboss technique, designed to allow for clearance around tall adjacent features surrounding the chip.

Vapor Chamber Heatsink with “Deep Draw” Emboss Technique

Low-profile Vapor Chamber

Low-profile vapor chamber with curved feature implemented into the base and fins, to allow for base to make contact with multiple tall components in addition to the main chip.

Low-profile Vapor Chamber

Vapor Chamber with Vertical Pipes

Vapor chamber with vertical pipes integrated into the same fluid loop. This solution provides maximum efficiency for moving heat from the source vertically to horizontal fins located above.

Vapor Chamber with Vertical Pipes

Vapor Chamber 1

Large footprint T-shaped vapor chamber with low-profile fins.

Vapor Chamber 1

Vapor Chamber 2

Custom shape and geometry for high-performance vapor chamber, all built into the hard-tooling for scalability.

Vapor Chamber 2

Vapor Chamber 3

High-performance vapor chamber with precision fabricated copper slug and TIM design for mating onto critical surface.

Vapor Chamber 3

VC Internal Guts

Close up of the internal structure of a typical powdered wick vapor chamber.

VC Internal Guts

T-shaped Vapor Chamber

T-shaped vapor chamber for maximum utilization of available space for cooling.

T-shaped Vapor Chamber

Small-footprint Vapor Chamber

Small-footprint vapor chamber allows for compact and effective cooling of high-powered chips in small design envelopes.

Small-footprint Vapor Chamber

High-performance Vapor Chamber

High-performance vapor chamber for cooling of high-powered chip in typical 1u or 2u chassis.

High-performance Vapor Chamber

High-Performance Vapor Chamber Heatsink

High-performance vapor chamber heatsink designed for up to 1000W, with support struts across the tops of the fins to add additional rigidity.

High-Performance Vapor Chamber Heatsink

Large footprint, High-performance VC Heatsink

Large footprint, high-performance vapor chamber heatsink designed for up to 1200W, with support struts across the tops of the fins to add additional rigidity.

Large footprint, High-performance VC Heatsink

Large Footprint Vapor Chamber Heatsink

Large footprint vapor chamber heatsink, designed to spread heat from 1000W high-heat-density chip to far reaches of the baseplate for cooling.

Large Footprint Vapor Chamber Heatsink

Custom Vapor Chamber

Custom vapor chamber for cooling of multiple touch points, utilizing low-profile zipper fins along with compliant thermal interface materials.

Custom Vapor Chamber
3D VC 3D VC
3D VC-2 3D VC-2
3D VC-3 3D VC-3
Board VC Board VC
Copper VC Base with Tall-Fins Copper VC Base with Tall-Fins
Thin VC with Customized Clearances and Geometry Thin VC with Customized Clearances and Geometry
A High-performance T-shaped VC A High-performance T-shaped VC
Compact Vapor Chamber Heatsink Compact Vapor Chamber Heatsink
Large Footprint Vapor Chamber Heatsink Large Footprint Vapor Chamber Heatsink
Custom Vapor Chamber Heatsink Custom Vapor Chamber Heatsink
High Performance VC Designed for ASICs High Performance VC Designed for ASICs
High Performance VC Designed for ASICs High Performance VC Designed for ASICs
High Performance Vapor Chamber High Performance Vapor Chamber
VC with Etched Bottom Mating Surface VC with Etched Bottom Mating Surface
Low-profile VC with Curved Feature Low-profile VC with Curved Feature
Vapor Chamber Heatsink with “Deep Draw” Emboss Technique Vapor Chamber Heatsink with “Deep Draw” Emboss Technique
Low-profile Vapor Chamber Low-profile Vapor Chamber
Vapor Chamber with Vertical Pipes Vapor Chamber with Vertical Pipes
Vapor Chamber 1 Vapor Chamber 1
Vapor Chamber 2 Vapor Chamber 2
Vapor Chamber 3 Vapor Chamber 3
VC Internal Guts VC Internal Guts
T-shaped Vapor Chamber T-shaped Vapor Chamber
Small-footprint Vapor Chamber Small-footprint Vapor Chamber
High-performance Vapor Chamber High-performance Vapor Chamber
High-Performance Vapor Chamber Heatsink High-Performance Vapor Chamber Heatsink
Large footprint, High-performance VC Heatsink Large footprint, High-performance VC Heatsink
Large Footprint Vapor Chamber Heatsink Large Footprint Vapor Chamber Heatsink
Custom Vapor Chamber Custom Vapor Chamber

Frequently Asked Questions

What is a vapor chamber heat sink?

A vapor chamber heat sink is a high-performance thermal solution that uses phase-change technology to rapidly spread heat across a sealed chamber. It efficiently transfers heat away from critical components, making it ideal for high-power and compact electronics. This design improves cooling performance, reduces temperature gradients, and enhances overall system reliability in demanding applications.

How does a vapor chamber heat sink work?

A vapor chamber heat sink works by evaporating liquid at the heat source and distributing vapor evenly across the chamber. The vapor condenses on cooler surfaces and returns as liquid through a wick structure, creating a continuous cycle. This process spreads heat uniformly, minimizes hotspots, and improves thermal efficiency compared to traditional conduction methods

When should I use a vapor chamber heat sink?

You should use a vapor chamber heat sink when managing high heat density in compact or performance-critical systems. It is ideal for applications where traditional heatsinks cannot effectively dissipate heat. This includes high-power electronics, dense packaging environments, and systems requiring uniform temperature control for stable operation.

What are the advantages of vapor chamber heat sinks over traditional heatsinks?

Vapor chamber heat sinks provide superior heat spreading, lower thermal resistance, and more uniform temperature distribution than traditional heatsinks. They improve cooling efficiency and reduce localized overheating in high-power systems. These advantages make them a preferred solution for advanced thermal management in compact and high-performance applications.

Can vapor chamber heat sinks be customized for my application?

Yes, vapor chamber heat sinks can be fully customized to meet specific thermal and mechanical requirements. Customization options include size, thickness, materials, wick structure, and integration with other cooling technologies. This ensures the solution is optimized for your system’s heat load, layout, and performance needs.

Are vapor chamber heat sinks suitable for low-profile designs?

Yes, vapor chamber heat sinks are highly suitable for low-profile and space-constrained designs. Their flat structure allows efficient heat spreading even in thin form factors. This makes them ideal for compact electronics, such as servers and high-density computing systems, where both space and thermal performance are critical.

What applications commonly use vapor chamber heat sinks?

Vapor chamber heat sinks are widely used in data centers, telecommunications, high-performance computing, and power electronics. These applications require efficient heat spreading and consistent cooling under heavy workloads. They are especially valuable in systems with high heat flux and limited space, where traditional cooling methods may not be sufficient.

What is a heatsink calculator?

A heatsink calculator helps estimate thermal performance by analyzing heat dissipation, airflow, and material properties to determine optimal cooling solutions.

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