Today’s CPUs, GPUs, and high performance ASICs are continually increasing their capacity, speed, and power, while being placed into smaller and more compact form factors, leading to increased power density. This leads to greater challenges from a thermal management perspective. Vapor Chamber Heat sinks, which work based on heatpipe principles, offer improved spreading efficiency, higher thermal conductivity, and reduced weight for these applications. Heatscape’s engineering team can deliver custom vapor chamber heat sinks solutions in custom sizes and shapes, including single and multi-stepped vapor chamber bases.