CFD-1Networking chassis thermal model which includes optimal design of inlet and exit, fan selection, and identification of hot spots CFD-2Wireless router thermal model posed challenges due to natural convection cooling method, small form factor, and high power components. CFD-3Progression of networking/telecom chassis design, starting with customers existing design, which includes inefficient recirculation zones and hot spots, to the Heatscape design showing improved airflow and lower temperatures. CFD-4Thermal design of high power graphics card solution using radial fin layout to better guide airflow from fan. CFD-5For this PCI-E heatsink, finely detailed meshing is required to build highly accurate thermal models. This is so that we can insure the accuracy of our CFD results compared to the actual testing results. |