Heatscape’s stacked fin solutions offer better performance when compared to typical extrusion heatsinks, due to thinner fin profiles leading to higher surface area and lower pressure drop.

By embedding heatpipes into the base of a heatsink, the spreading capability of the base, and therefore the overall heatsink performance can be greatly improved.

When more typical heatsink technologies are no adequate, Vapor Chamber Heatsinks should be considered, allowing for extremely efficient heat spreading, significantly improving thermal performance.

Extruded aluminum heatsinks are an effective way to cool heat producing components in a cost effective manner.

With the rising functionality and computing power of graphics boards and GPUs comes greatly increased thermal challenges.

Skiving is a manufacturing process where thermal solutions are formed by shaving one solid block of copper or aluminum into a finned heatsink.

Optical modules are becoming more high-powered, requiring the need for advanced heatsink designs to efficiently cool them.

PCI-E heatink that uses heatpipes for more heatspreading and better performance

Heatscape specializes in fabricated metal products to go along with our thermal solutions.